BaiTECH Solutions provides wire bonding and die bonding process development.
We offer manufacturing evaluations to increase yields, reduce costs & optimize.
We can provide support on special projects both short and long term in nature.
for OEM Equipment, Consumables and Services for the microelectronic industry.
SALES, CONSULTING AND TRAINING FOR THE MICRO-ELECTRONIC INDUSTRY SPECIALIZING IN WIRE BONDING dIE BONDING AND PULL/SHEAR TESTING
We provide equipment purchase support with selection and implementation.
BaiTECH Solutions offers customized training sessions either on-site or off-site.