We offer manufacturing evaluations to increase yields, reduce costs & optimize.
BaiTECH Solutions provides wire bonding and die bonding process development.
SALES, CONSULTING AND TRAINING FOR THE MICRO-ELECTRONIC INDUSTRY SPECIALIZING IN WIRE BONDING dIE BONDING AND PULL/SHEAR TESTING
BaiTECH Solutions offers customized training sessions either on-site or off-site.
for OEM Equipment, Consumables and Services for the microelectronic industry.
We provide equipment purchase support with selection and implementation.
We can provide support on special projects both short and long term in nature.