SALES, CONSULTING AND TRAINING FOR THE MICRO-ELECTRONIC INDUSTRY SPECIALIZING IN WIRE BONDING dIE BONDING AND PULL/SHEAR TESTING
for OEM Equipment, Consumables and Services for the microelectronic industry.
BaiTECH Solutions provides wire bonding and die bonding process development.
We offer manufacturing evaluations to increase yields, reduce costs & optimize.
BaiTECH Solutions offers customized training sessions either on-site or off-site.
We provide equipment purchase support with selection and implementation.
We can provide support on special projects both short and long term in nature.