soldering systems for vacuum supported soldering

​PINK offers innovative soldering technologies for void free connections of power semiconductors, hybrid- and multi-chip assemblies as well as electronic packages. The whole assortment - from Batch versions for laboratory applications and production of small series right up to fully automated high performance inline systems - offers an identical processing technology and highest performance. A continuous recording of all process data ensures process reliability, quality and trace-ability.

Southern California - Arizona

New Mexico - Mexico

California - Arizona

New Mexico - Mexico

Southern California - Arizona

New Mexico - Mexico

table top die bonding solutions for micro-electronics

For over 30 years, Tresky Switzerland has been perfecting the art of creating table top handling and pick & place systems. As a die bonding solutions provider, they support specific applications with highly accurate and innovative systems. Table Top Epoxy Die Bonding, Eutectic Die Bonding, Flip Chip Bonding, Epoxy/Adhesive Stamping, Epoxy/Adhesive Dispensing using manual and semi-automatic systems.

Representing

Representing

Partner

Customize the interior to exceed the application.
Specify and customize the layout of every option inside the bonder.

California - Arizona

New Mexico - Mexico

Representing

Manual, Semi-automatic and automatic Wire bonding equipment 

Since 1966, West•Bond has designed and manufactured a renowned line of wire bonding and die attach machines, wire pull and shear test equipment, ultrasonic components, and accessories for the microelectronics packaging industry. They are perhaps best known for their patented single input X-Y-Z micro-manipulator. This unique mechanism on their manual and semi-automatic series machines provides exceptional ease of operation and versatility of application. It accepts the inputs at which humans excel, and continues with the execution of programs of user data under operator and/or digital motor control. In their automatic series machines, data input is via a graphical user interface, and alignment verification is by optical pattern recognition..

Southern California - Arizona

New Mexico - Mexico

Contract manufacturing located in nashua, NH

​Merrimack Micro offers state of the art repeatable automatic die attach and wire bond manufacturing. With high speed automatic material handling and custom fixturing, they can automate any of your process requirements and meet your quality standards and delivery schedules. Their facility manufactures power hybrids, COB, Hi-Temp electronics, solar components/panels and full LED assemblies for our customers. Full LED assemblies include COB, PCB assembly, and box build. Their high quality lead-free soldering capabilities allow them to provide a flexible option to meet your specific needs. Also, as a reliable manufacturer, they can gold wire bond to the thinest gold platings to help reduce their customers expensive gold plating costs on their substrates.

Manual, semi-automatic and fully automatic wire bonders. Offering wedge, ball and ribbon bonding.

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Ultrasonic fine wire, heavy wire, deep access bonding wedges

DeWeyl Tool strives to provide the finest quality bonding wedges in the world. Located in Petaluma, CA (Northern California) in the Sonoma / Napa wine region, their primary business is manufacturing wirebond wedges, die pickup tools, and custom high precision tooling for the semiconductor, aerospace, and medical industries. The wedges they produce are made from ceramic, titanium, and tungsten carbide, and are used in bonding aluminum, gold, copper, and platinum wires.

Partner

Southern California - Arizona

New Mexico - Mexico

Representing

Automated die bonding solutions for micro-electronics

For over 30 years, TRESKY has been perfecting the art of creating die bonding solutions. TRESKY Automation in Germany offers the Automated T-6000 and the T-8000 die bonder platforms. Offering Automated Epoxy Die Bonding, Eutectic Die Bonding, Flip Chip Bonding, Epoxy/Adhesive Stamping, Epoxy/Adhesive Dispensing systems. TRESKY offers customized interior layouts based on application demands. TRESKY also provides fully automated magazine to magazine material handling solutions.

FULLY AUTOMATED PULL TEST and SHEAR TEST EQUIPMENT

XYZTEC is the technology leader in bond testing worldwide. The Condor Sigma is the most advanced bond tester on the market, providing leading customers with fully automated testing solutions including pattern recognition.The Revolving Measurement Unit (RMU) offers six test sensors. No need to change test cartridges manually. The Revolving Measurement Unit (RMU) enables continuous operation with up to six different test types within one machine at forces up to 200kg. Additionally, you can also choose for dedicated test head systems. XYZTEC is also unique in its high force products and next generation tweezers.

llc

California - Arizona

New Mexico - Mexico

​​SALES, CONSULTING AND TRAINING FOR THE MICRO-ELECTRONIC INDUSTRY SPECIALIZING IN WIRE BONDING dIE BONDING AND PULL/SHEAR TESTING