California - Arizona

New Mexico - Mexico

Representing

California - Arizona

New Mexico - Mexico

llc

table top die bonding solutions for micro-electronics

For over 30 years, Tresky Switzerland has been perfecting the art of creating table top handling and pick & place systems. As a die bonding solutions provider, they support specific applications with highly accurate and innovative systems. Table Top Epoxy Die Bonding, Eutectic Die Bonding, Flip Chip Bonding, Epoxy/Adhesive Stamping, Epoxy/Adhesive Dispensing using manual and semi-automatic systems. Baitech Solutions LLC is your local California, Arizona, New Mexico and Mexico resource for sales, installation and warranty support.

Representing

Ultrasonic fine wire, heavy wire, deep access bonding wedges

DeWeyl Tool strives to provide the finest quality bonding wedges in the world. Located in Petaluma, CA (Northern California) in the Sonoma / Napa wine region, their primary business is manufacturing wirebond wedges, die pickup tools, and custom high precision tooling for the semiconductor, aerospace, and medical industries. The wedges they produce are made from ceramic, titanium, and tungsten carbide, and are used in bonding aluminum, gold, copper, and platinum wires. Baitech Solutions LLC is your local SoCal, AZ, NM and Mexico resource for sales and applications support.

Representing

Representing

​​SALES, CONSULTING AND TRAINING FOR THE MICRO-ELECTRONIC INDUSTRY SPECIALIZING IN WIRE BONDING dIE BONDING AND PULL/SHEAR TESTING 

California - Arizona

New Mexico - Mexico

Representing

Representing

California - Arizona

New Mexico - Mexico

California - Arizona

New Mexico - Mexico

Representing

Partner

California - Arizona

New Mexico - Mexico

Partner

Automated die bonding solutions for micro-electronics

For over 30 years, TRESKY has been perfecting the art of creating die bonding solutions. TRESKY Automation in Germany offers the Automated T-6000 and the T-8000 die bonder platforms. Offering Automated Epoxy Die Bonding, Eutectic Die Bonding, Flip Chip Bonding, Epoxy/Adhesive Stamping, Epoxy/Adhesive Dispensing systems. TRESKY offers customized interior layouts based on application demands. TRESKY also provides fully automated magazine to magazine material handling solutions. (Center Photo). Baitech Solutions LLC is your local Southern California, Arizona, New Mexico and Mexico resource for sales, installation and warranty support.

MANUAL, SEMI-AUTOMATIC AND AUTOMATIC WIRE BONDING EQUIPMENT

TPT wire bonders are made in Germany and are used in the development and production of micro-electronics around the world. Their goal is to support developers in realizing new ideas and applications for microelectronics. Their customers are startups, Universities and Large corporations, in more than 40 countries around the globe. TheHB05 offers fully manual fine wire bonders. The HB10 offers fine wire semi-automated bonding with a motorized Z operation. The HB16 offers semi-automated motorized Z and Y operation wire bonders. The HB30 offers heavy wire bonding. The HB100 offers a table top fine wire automated wire bonding. TPT also offers die bonding and pull testing options on their systems. Machine convertibility and flexibility are key attributes. Baitech Solutions LLC is your local SoCal, AZ, NM and Mexico resource for sales, installation and warranty support.

Southern California - Arizona

New Mexico - Mexico

Microelectronics and Packaging AOI

Machine Vision Products, Inc. has extensive experience in a wide range of AOI Microelectronics and Packaging applications. MVP works with the world’s leading manufacturers on a global basis. From multiple die and wire technologies to leadframe, ball grid array and surface inspection applications. MVP has the widest applications toolbox of any AOI provider. MVP takes pride in the fact that they supply many complex inspection solutions to diverse industries such as Automotive, Telecoms, Medical Devices, Military, and Space. 

FULLY AUTOMATED PULL TEST and SHEAR TEST EQUIPMENT

XYZTEC is the technology leader in bond testing worldwide. The Condor Sigma is the most advanced bond tester on the market, providing leading customers with fully automated testing solutions including pattern recognition.The Revolving Measurement Unit (RMU) offers six test sensors. No need to change test cartridges manually. The Revolving Measurement Unit (RMU) enables continuous operation with up to six different test types within one machine at forces up to 200kg. Additionally, you can also choose for dedicated test head systems. XYZTEC is also unique in its high force products and next generation tweezers. Baitech Solutions LLC is your local CA, AZ, NM and Mexico resource for sales, installation and warranty support.

California - Arizona

New Mexico - Mexico

Compact batch VACUUM OVENS FOR REFLOW SOLDERING 

Invacu Ltd was established in 2008. The Company started with design, installation and testing of electrical and electronic modules and control devices in industrial furnaces used in the process of production of semiconductors. Through the years, the Company’s activities grew into developing of complete proprietary devices. The main focus of the Company’s activities is developing of computer controlled machines. Invacu’s flexible engineering team provides quality designs, and the technical team – precision in the design execution. Even the most demanding clients with most exact technical requirements and high quality criteria remain satisfied with our products. 

SOLDERING SYSTEMS FOR VACUUM SUPPORTED SOLDERING

PINK offers innovative soldering technologies for void free connections of power semiconductors, hybrid- and multi-chip assemblies as well as electronic packages. The whole assortment - from Batch versions for laboratory applications and production of small series right up to fully automated high performance inline systems - offers an identical processing technology and highest performance. A continuous recording of all process data ensures process reliability, quality and trace-ability.