This pump weighs only 16 pounds and has a handle, so it's convenient for on-site sampling, atomizing, and vacuum filtration. It'salso for use in pressure applications up to 60 psi. Since it doesn't require lubrication, there’s no risk of oil contamination. Maximum flow rate is the rate at which air is pumped before a vacuum is created. Flow rate steadily decreases as the pump generates the vacuum. The larger the tank, the longer it will take to form a vacuum. Tube and fitting ID will also affect flow.
The complete package consists of one tester with microscope and your choice of eyepieces, base/stand, four pull gauges (35g, 50g, 100g, and 150g) with one hook for each, four calibration weights (15g, 25g, 50g, and 75g), and an accessory chuck.
Wire Bond-Die Bond-Flip Chip Overview Training
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Press the flat side of the gauge tip UP against the transducer to record the amount of the gram force on the bonding wedge. They have an aluminum housing and a 1 1/2" dia. dial with a plastic lens. Furnished in a plastic case.
Capacity, g Accuracy, g Graduations, g Ht. Wd. Dp. Part Number
0 to 10 ±0.2 0.2 3 3/4" 1 3/4" 1" BTS2015-1368T21
10 to 50 ±1 1.0 3 3/4" 1 3/4" 1" BTS2015-1368T3
50 to 150 ±5 5.0 3 3/4" 1 3/4" 1" BTS2015-1368T52
50 to 250 ±10 10.0 3 3/4" 1 3/4" 1" BTS2015-1368T62
Xyztec Automation Training
The complete package consists of one tester, all four gauges (with one pull hook for each), all four calibration weights, and an accessory chuck.
With an overall length of 3 1/2", the drivers are short enough to fit into tight spaces. Sets include eight complete drivers and a large secondary handle(3 1/8" long) that slips over the driver handle to provide greater torque and a more comfortable grip.
Hex Sizes 9-Piece Inch Set 0.028", 0.035", 0.050", 1/16", 5/64", 3/32", 7/64", and 1/8".
SALES, CONSULTING AND TRAINING FOR THE MICRO-ELECTRONIC INDUSTRY SPECIALIZING IN WIRE BONDING dIE BONDING AND PULL/SHEAR TESTING